Systems Engineering Seminar

What Systems Engineers Need to Know About EEE Parts

Presented by:
Harry Shaw,
Chief Technologist,
Parts, Packaging and Assembly Technologies Office, Code 562
and Jeannette Plante of Dynamic Range Corporation (DRC)

April 8, 2003, 1:00 p.m.
GSFC Building 3 Auditorium

Abstract:

Every NASA project and instrument is heavily dependent upon Electrical, Electronic and Electromechanical (EEE) parts. The discipline of Parts Engineering is an often misunderstood and under-appreciated activity on NASA projects. The purpose of this talk is to provide Systems Engineers and Managers with key information and resources about Parts Engineering at GSFC. Definition of Project Parts Requirements, key specifications and documents, and the Parts Engineering process within the project life cycle will be discussed. Emerging issues such as the usage of Commercial-off-the-shelf (COTS) parts, Plastic Encapsulated Microcircuits (PEMS) will be discussed. Integration of new parts technologies into flight projects will be discussed.

Biography:

Harry Shaw is the Chief Technologist of the newly re-organized Parts, Packaging, and Assembly Technology Office in AETD (Code 562). He is in charge of the new technology development in photonics, advanced packaging, nanotechnology and microelectronics development within the Office. He has been at GSFC for 12 years in a variety of line and project assignments.

Jeannette Plante runs the Electrical, Electronic and Electromechanical (EEE) parts and packaging engineering consulting company Dynamic Range Corporation (DRC) which offers engineering services in the areas of EEE parts selection, supply chain management and assurance. Services are also available for electronic packaging analysis and design. The emphasis is on high reliability applications including space hardware. Dynamic Range has most recently supported the following projects for external customers and through internal research and development:

• Project Parts Management for the MLA Instrument (Messenger Spacecraft)
• Research on parts upgrading costs for small to large flight programs
• Characterization of Field Programmable Analog Arrays
• Ruggedization study for 3D memories
• Advanced substrate technologies including embedded passives
• Research on Horsting voids in electronic wire bonds
• Information management tools for electronic parts engineering
• Facilitation process for small business, fables vendors seeking QML certification